发明名称 LIGHT EMITTING ELEMENT PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting element package which achieves stable color reproduction rate and color representation and has excellent heat radiation characteristics and improved doping efficiency. <P>SOLUTION: A light emitting element package includes: a body 110 having a cavity; at least one insulation layers 120, 130 disposed on the body 110; first and second electrode layers 142, 144 respectively disposed on the insulation layers and electrically separated from each other; at least one light emitting element 150 disposed on a bottom surface of the cavity and electrically connected with the first and second electrode layers 142, 144; a light transmission resin layer 160 sealing the light emitting element 150 disposed in the cavity; and a metal layer 170 facing the light emitting element 150 on a rear surface of the body 110. The light emitting element 150 has a light emitting structure which grows on a surface of a substrate (1123) in an m direction and has a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013123057(A) 申请公布日期 2013.06.20
申请号 JP20120271170 申请日期 2012.12.12
申请人 LG INNOTEK CO LTD 发明人 YUN HYEONG SEON;LEE EUN DK
分类号 H01L33/48;H01L33/04;H01L33/10;H01L33/16 主分类号 H01L33/48
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