发明名称 |
CONDUCTIVE PATH STRUCTURE AND WIRE HARNESS |
摘要 |
A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and a semi-solid state insulation member that is in a semi-solid state and covers the cut-off facilitating portion. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the semi-solid state insulation member covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion.
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申请公布号 |
US2013153294(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201113819118 |
申请日期 |
2011.09.16 |
申请人 |
ADACHI HIDEOMI;KUBOSHIMA HIDEHIKO;YAZAKI CORPORATION |
发明人 |
ADACHI HIDEOMI;KUBOSHIMA HIDEHIKO |
分类号 |
H01R3/00 |
主分类号 |
H01R3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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