发明名称 LAMINATED SUBSTRATE-SCRIBING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminated substrate-scribing apparatus usable for a substrate processing system where a unit display panel arranged on a mother board comprising a laminated substrate in prescribed layout can be taken out without damaging a terminal region. <P>SOLUTION: A scribe apparatus control section is provided which adjusts the depths of three scribe grooves formed at specified boundaries and controls an end material region at a position facing the terminal region to be left at specified positions, at the time of scribe-processing the specified boundaries which include the terminal region. Thus, separation is ensured even a terminal has a narrow width. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013121913(A) 申请公布日期 2013.06.20
申请号 JP20130005730 申请日期 2013.01.16
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TAKAMATSU IKUYOSHI;MAEKAWA KAZUYA
分类号 C03B33/07;B28D5/00;C03B33/037;G02F1/13 主分类号 C03B33/07
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