发明名称 |
LAMINATED SUBSTRATE-SCRIBING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated substrate-scribing apparatus usable for a substrate processing system where a unit display panel arranged on a mother board comprising a laminated substrate in prescribed layout can be taken out without damaging a terminal region. <P>SOLUTION: A scribe apparatus control section is provided which adjusts the depths of three scribe grooves formed at specified boundaries and controls an end material region at a position facing the terminal region to be left at specified positions, at the time of scribe-processing the specified boundaries which include the terminal region. Thus, separation is ensured even a terminal has a narrow width. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013121913(A) |
申请公布日期 |
2013.06.20 |
申请号 |
JP20130005730 |
申请日期 |
2013.01.16 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
TAKAMATSU IKUYOSHI;MAEKAWA KAZUYA |
分类号 |
C03B33/07;B28D5/00;C03B33/037;G02F1/13 |
主分类号 |
C03B33/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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