发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system including: providing a package carrier; mounting an integrated circuit to the package carrier; mounting a circuit interposer above the integrated circuit; mounting a mounting integrated circuit above the circuit interposer; forming a conductive pillar to the circuit interposer adjacent to the mounting integrated circuit; connecting the circuit interposer to the package carrier; and forming an encapsulation on the package carrier.
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申请公布号 |
US2013154092(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201113327609 |
申请日期 |
2011.12.15 |
申请人 |
YANG DEOKKYUNG;YOON IN SANG;MUN SEONGHUN;KIM KYUNGHWAN |
发明人 |
YANG DEOKKYUNG;YOON IN SANG;MUN SEONGHUN;KIM KYUNGHWAN |
分类号 |
H01L23/485;H01L21/58;H01L21/60 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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