发明名称 |
DEVICE MOUNTING BOARD, CELL, AND BATTERY MODULE |
摘要 |
A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions. |
申请公布号 |
US2013157102(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201313768777 |
申请日期 |
2013.02.15 |
申请人 |
SANYO ELECTRIC CO., LTD.;SANYO ELECTRIC CO., LTD. |
发明人 |
NAGAMATSU MASAYUKI;NAKASATO MAYUMI;YANASE YASUYUKI |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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