ELECTRICALLY CONDUCTIVE POLYMERIC COMPOSITONS, CONTACTS, ASSEMBLIES, AND METHODS

摘要

Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250°C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) ethylenically unsaturated monomers or oligomers with hydroxyl groups, and (ii) blocked isocyanates with unblocking temperatures below 200°C. Also described are electronic assemblies such as solar cells using the various compositions and related methods.