INDUCTORS WITH THROUGH VIAS

摘要

A device using an inductor with one or more through vias, and a method of manufacture is provided. In an embodiment, an inductor is formed in one or more of the metallization layers. One or more through vias are positioned directly below the inductor. The through vias may extend through one or more dielectric layers interposed between a substrate and the inductors. Additionally, the through vias may extend completely or partially through the substrate.