According an embodiment, a package-on-package heatsink interposer for use between a top package and a bottom package of a package-on-package device, may include a top heatsink below the top package; an interposer substrate below the top heatsink; a bottom heatsink below the interposer substrate; a first interposer substrate metal layer between the interposer substrate and the top heatsink; a second interposer substrate metal layer between the interposer substrate and the bottom heatsink; and interposer solder balls between the second interposer substrate metal layer and the bottom package.
申请公布号
WO2013088263(A2)
申请公布日期
2013.06.20
申请号
WO2012IB03096
申请日期
2012.12.11
申请人
CANADIAN INTELLECTUAL PROPERTY OFFICEATI TECHNOLOGIES ULC;TOPACIO, RODEN R.;MARTINEZ, LIANE;LOW, YIP SENG