| 摘要 |
A PCB structure is provided. The material of the adhesion is replaced by silicone from conventional Epoxy or Acrylic acid. The problems of unclear signal and voltage drop caused by moisture are overcame due to the characteristic of non-polar and non-hydrophile of the silicone. Also, the silicone layer has two modified silicone layers disposed two sides thereon to enhance the adhesion between the silicone and substrate/metal layer. The problems of producing bubbles or easy to peel off are solved. |
