| 摘要 |
PURPOSE: A bonding device including a bonding temperature optimizing device and an optimizing method of bonding temperature using the same are provided to optimize the bonding temperature corresponding to a bonding object by detecting the temperature of binding agents arranged between the bonding objects when bonding the bonding object with ultrasonic waves or a thermo compression bonding method. CONSTITUTION: A bonding device including a bonding temperature optimizing device comprises an ultrasonic generator(110), a vibration tool(120), a temperature detecting unit(130), a display unit(140), and a control unit(150). The ultrasonic generator converts common electricity applied from the outside into electric power of an ultrasonic frequency. The vibration tool converts the electric power into mechanical vibration energy and transfers amplified vibration energy to a binding agent(15) arranged between a bonding objects(10). The temperature detecting unit is located between the bonding objects and directly detects heating temperature generated in the binding agent due to the vibration energy. The display unit displays one of temperature detected through the temperature detecting unit or a waveform of the electric power outputted from the ultrasonic generator. The control unit mutually compares the predetermined temperature with the temperature detected through the temperature detecting unit and variably controls output of the ultrasonic frequency so that the detected temperature is closed to the predetermined temperature. The control unit stores outputs in which are variably controlled according to time. [Reference numerals] (110) Ultrasonic generator; (140) Display unit; (150) Control unit; (160) Input unit; (AA) Commercial electricity |
