发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminated body for an oxide semiconductor electrode and an oxide semiconductor electrode which are superior in an adhesion property between a porous layer and a first electrode layer. <P>SOLUTION: The laminated body for an oxide semiconductor electrode comprises a heat-resistant substrate, a porous layer formed on the heat-resistant substrate and including metal oxide semiconductor fine particles made of first metal oxide, and a first electrode layer formed on the porous layer and made of second metal oxide. In the laminated body for an oxide semiconductor electrode, a mixed oxide layer including the first metal oxide and the second metal oxide is formed between the porous layer and the first electrode layer, and the porous layer and the first electrode layer are formed to be in contact with the mixed oxide layer. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP5217337(B2) 申请公布日期 2013.06.19
申请号 JP20070252143 申请日期 2007.09.27
申请人 发明人
分类号 H01M14/00;H01L31/04 主分类号 H01M14/00
代理机构 代理人
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