Lead Frame with Die Attach Bleeding Control Features
摘要
<p>Consistent with an example embodiment, a lead frame is configured to accommodate an electronic device of a size. The lead frame comprises a die attach pad upon which an electronic device is mounted; a distance between edges of the mounted electronic device and edges of the die attach pad defines a boundary clearance. A plurality of cavities is defined on the periphery of the die attach pad, about the edge of the boundary clearance, the size of the cavities determined by the size of the electronic device mounted on the die attach pad. During die attach, the plurality of cavities serves to contain the die attach material on the die attach pad within the boundary clearance.</p>
