| 摘要 |
PURPOSE: A semiconductor manufacturing process inspecting method of an inspection apparatus is provided to immediately sense the shutdown of the apparatus, thereby preventing the generation of a process failure in advance. CONSTITUTION: An initial index image converts the color data of each pixel of a standard image into the numeric data, and is generated(S506). A control index image removes the column and row pixels of an area which does not corresponds to a comparative object in the initial index image, and is generated(S508). The similarity of a reference image and a semiconductor image is determined for the control index images(S510). If the similarity of the semiconductor image is lower than certain standard, a manufacturing process of the semiconductor is determined as the failure has occurred(S514). A message which informs the failure of the manufacturing process of the semiconductor is transmitted to an inspection apparatus and an administrator terminal(S516). [Reference numerals] (AA) Start; (BB,DD) Yes; (CC,EE) No; (FF) End; (S502) Is a semiconductor image received?; (S504) Generate a reference image by integrating each pixel into a representative color by reconfiguring a reference image and a semiconductor image by each pixel unit; (S506) Generate an initial index image by converting color data of each pixel of the reference image into numeric data; (S508) Generate a control index image by removing a row pixel and a column pixel in an area where a comparison target is not corresponded in the initial index image; (S510) Determine the similarity of the reference image and the semiconductor image by comparing numeric data between pixels matched with the reference image and the semiconductor image; (S512) Is similarity low?; (S514) Determine that there is an error in a manufacturing process of a corresponding semiconductor; (S516) Transmit a message that there is an error in the manufacturing process to an test device and a management terminal
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