| 摘要 |
PROBLEM TO BE SOLVED: To achieve simplification of a structure by effectively utilizing a driving device rotating a disk substrate, and to achieve promotion of curing while preventing warpage of the disk substrate. SOLUTION: A substrate processing apparatus 10 cures an uncured disk substrate D while reducing warpage thereof by rotating the uncured disk substrate D, and includes: a supporting means 11 supporting a center part of the disk substrate D; a driving means 13 imparting rotational force to the supporting means 11; a plurality of rotational vanes 27 connected to an output shaft 23 of the driving means 13; and a wind guiding means 17 securing a passage of air. Warpage is prevented by rotating the disk substrate D and promotion of curing of the disk substrate D is achieved by air pulled in the wind guiding means 17 by rotation of the rotational vanes 27. COPYRIGHT: (C)2011,JPO&INPIT |
