发明名称 |
LED lighting assemblies with thermal overmolding |
摘要 |
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
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申请公布号 |
US8465175(B2) |
申请公布日期 |
2013.06.18 |
申请号 |
US20050289672 |
申请日期 |
2005.11.29 |
申请人 |
NALL JEFFREY;MRAKOVICH MATTHEW;GE LIGHTING SOLUTIONS, LLC |
发明人 |
NALL JEFFREY;MRAKOVICH MATTHEW |
分类号 |
F21K99/00;F21S4/00;F21V21/00 |
主分类号 |
F21K99/00 |
代理机构 |
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代理人 |
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地址 |
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