发明名称 Capacitorless DRAM on bulk silicon
摘要 A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate is provided, and an array of silicon studs is defined within the silicon substrate. An insulator layer is defined atop at least a portion of the silicon substrate, and between the silicon studs. A silicon-over-insulator layer is defined surrounding the silicon studs atop the insulator layer, and a capacitorless DRAM is formed within and above the silicon-over-insulator layer.
申请公布号 US8466517(B2) 申请公布日期 2013.06.18
申请号 US201213445711 申请日期 2012.04.12
申请人 MATHEW SURAJ;TRIVEDI JIGISH D.;MICRON TECHNOLOGY, INC. 发明人 MATHEW SURAJ;TRIVEDI JIGISH D.
分类号 H01L27/12 主分类号 H01L27/12
代理机构 代理人
主权项
地址