| 摘要 |
According to one embodiment, a semiconductor device includes a semiconductor substrate of a first conductivity type, an element isolation insulator, a source layer of a second conductivity type, a drain layer of the second conductivity type, a contact layer of the first conductivity type and a gate electrode. The element isolation insulator is formed on the semiconductor substrate. The source layer is formed on the semiconductor substrate and is in contact with a side surface of the element isolation insulator. The drain layer is formed on the semiconductor substrate, is in contact with the side surface, and is spaced from the source layer. The contact layer is formed between the source layer and the drain layer. The gate electrode is provided on the element isolation insulator along the side surface.
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