发明名称 |
Method of manufacturing a printed circuit board having metal bumps |
摘要 |
A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.
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申请公布号 |
US8464423(B2) |
申请公布日期 |
2013.06.18 |
申请号 |
US201113373387 |
申请日期 |
2011.11.14 |
申请人 |
KANG MYUNG SAM;PARK JEONG WOO;KIM OK TAE;YUN KIL YONG;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG MYUNG SAM;PARK JEONG WOO;KIM OK TAE;YUN KIL YONG |
分类号 |
H01R9/00;H01R43/00;H01R43/16;H05K3/00;H05K3/02;H05K3/10 |
主分类号 |
H01R9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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