COOLING DEVICE FOR HEATING PARTS AND POWER SEMICONDUCTOR MODULE HAVING THE SAME

摘要

PURPOSE: A cooling device for heating parts and a power semiconductor module having the same are provided to improve exothermic performance by using an improved cooling channel structure for obtaining uniform flux distribution. CONSTITUTION: A device casing(40) includes a heating part(20) having a heating element(10). A cooling channel is formed in the device casing. The device casing includes an introduction part(42) having an inlet(42a) for cooling water and an exhausting part(44) having an outlet(44a) for the cooling water. The device casing further includes curved part(46,50) for integrating the cooling channel. A flow control unit(60) includes a first and a second channel partition(62,64) arranged at regular intervals.