发明名称 Feedback for polishing rate correction in chemical mechanical polishing
摘要 A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
申请公布号 US8467896(B2) 申请公布日期 2013.06.18
申请号 US201213480434 申请日期 2012.05.24
申请人 QIAN JUN;GARRETSON CHARLES C.;DHANDAPANI SIVAKUMAR;DAVID JEFFREY DRUE;LEE HARRY Q.;APPLIED MATERIALS, INC. 发明人 QIAN JUN;GARRETSON CHARLES C.;DHANDAPANI SIVAKUMAR;DAVID JEFFREY DRUE;LEE HARRY Q.
分类号 G06F19/00;B24B49/04;B24B49/12 主分类号 G06F19/00
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