WAFER LAMINATED BODY AND METHOD FOR BONDING AND DEBONDING BETWEEN DEVICE WAFER AND CARRIER WAFER

摘要

PURPOSE: A wafer laminated body and a method for bonding and debonding a wafer and a carrier wafer are provided to reduce process time by using an adhesive layer consisting of a photolysis layer. CONSTITUTION: A protection layer is formed in one surface of a device wafer. A carrier wafer(30) supports the device wafer. A charging layer(40) is formed in one surface of the carrier wafer. A photolysis layer(50) is formed at the edge part on the charging layer. The photolysis layer temporality bonds the device wafer to the carrier wafer.