发明名称 COIL SPRING MEASURING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a coil spring measuring device capable of reducing a data processing load compared with a conventional one. <P>SOLUTION: The coil spring measuring device supports a coil spring 90 in a rotationally drivable manner and includes a laser irradiation device 31, facing a winding shaft J1 of the coil spring 90 across a wire material, in a linearly movable manner in a direction of the winding shaft J1. The laser irradiation device 31 is configured to scan along an irradiation line and to acquire the outer surface shape of the wire material as two-dimensional position data. The coil spring 90 is rotationally driven by a feed angle &theta; at a time, and the laser irradiation device 31 is linearly moved such that the wire material is disposed in a scanning original position set on a scanning coordinate axis parallel with the irradiation line. The pitch P of the coil spring 90 is computed based on the amount of linear motion of the laser irradiation device 31 during one rotation of the coil spring 90. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013119088(A) 申请公布日期 2013.06.17
申请号 JP20110266710 申请日期 2011.12.06
申请人 ASAHI- SEIKI MANUFACTURING CO LTD 发明人 NAKAI KENICHI;SUGIYAMA HIROSHI
分类号 B21F35/00;G01B11/02 主分类号 B21F35/00
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