METHOD AND STRUCTURE FOR PROTECTION AGAINST VIA FAILURE

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a decoy via and a functional via.

SOLUTION: Provided is a semiconductor device comprising: a first interconnect layer having a plurality of metal portions including a first metal portion; a second interconnect layer having plurality of metal portions including a second metal portion; a third interconnect layer having a plurality of metal portions including a third metal portion; a functional via coupled to the first metal portion and the second metal portion; and a decoy via in a protection region around the functional via, the decoy via coupled to the first metal portion and the third metal portion.

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