| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a soft metal laminate of a multi-layered polyimide structure. <P>SOLUTION: In the multi-layered polyimide soft metal laminate and the method of manufacturing thereof, in metal foil 60 and a multi-layered polyimide formed on one or both surface(s) of the metal foil, the multi-layered polyimide different in linear thermal expansion coefficient, and gradient layers 40, 50 in which gradients are formed between the multi-layered polyimide layers 10, 20, 30 by a difference in a linear thermal expansion coefficient between the respective polyimide layers of the multi-layered polyimide are included. The soft metal laminate of the multi-layered polyimide structure is a soft metal laminate for a printed circuit board excellent in adhesive strength with the metal foil and size stability while solving a foaming problem between the polyimide layers. <P>COPYRIGHT: (C)2013,JPO&INPIT |
