| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing electronic components, exhibiting excellent low-shrinkage that, in a package of a double-sided cooling structure exhibiting high heat dissipation performance, causes no interfacial peeling or the like inside the package to enhance reliability for devices. <P>SOLUTION: The epoxy resin composition for sealing electronic components comprises the following components (A)-(E), where the content of the component (D) is 82-88 wt.% of the whole amount of epoxy resin composition; the content of the component (E) is 5-15 wt.% of the whole amount of organic components in the epoxy resin composition; and the epoxy resin composition has a gel time of 15-25 seconds: (A) an epoxy resin having an ICI viscosity of 0.008-0.1 Pa s and an epoxy equivalent of 100-200 g/eq; (B) a phenol resin having an ICI viscosity of 0.008-0.1 Pa s and a hydroxy-group equivalent of 100-200 g/eq; (C) a curing accelerator; (D) an inorganic filler; and (E) a silicone compound. <P>COPYRIGHT: (C)2013,JPO&INPIT |
