APPARATUS TO SPUTTER

摘要

PURPOSE: A sputter device is provided to increase a deposition rate by applying a high power by cooling a target using a cooling unit separately installed from the target, or by contacting with an outer surface of the target. CONSTITUTION: A sputter device comprises a chamber(110), and a rotational cathode(140), and a cooling unit(200). The chamber forms an evaporation space about a substrate(10). The rotational cathode installed in the inside of the chamber comprises a target(Ta) providing a deposition material to the substrate. The cooling unit is contacted to an outer surface of the target and cools the target.