| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated substrate that hardly causes warpage therein even under high temperatures. <P>SOLUTION: The laminated substrate has a metal layer provided on at least one of a principal surface and a rear surface of an insulating substrate. The metal layer has a frame part that is formed along a frame of the insulating substrate and an electrode pattern forming part that is formed in an inner side than the frame part. The frame part is a part that is divided into a plurality of regions by having two or more grooves therein which are formed so as to cross the frame part from an inner side to a frame of the laminated substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
