| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cushioning material having high cleanliness which has not been materialized so far, more specifically a cushioning material having high cleanliness from which particles such as dust and dirt, floating in the air and adhering to the cushioning material, can be removed and generation of dust and dirt from the cushioning material itself can be suppressed. <P>SOLUTION: The wafer protection cushioning material is produced by laminating a synthetic resin film to both surfaces of a soft foam sheet, and the synthetic resin film has a surface resistance of 10<SP POS="POST">3</SP>-10<SP POS="POST">12</SP>Ω. <P>COPYRIGHT: (C)2013,JPO&INPIT |
