| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging structure of an electronic component which enables power supply wiring to be connected easily and electrically in regions, where the power supply wiring is divided, at low cost even when a feed-through capacitor is not mounted and inhibits harmful effects from occurring due to heat generated in a jumper chip component. <P>SOLUTION: Power supply wiring 13 is divided in first and second regions 14, 15. Ground wiring 16 extends passing the first region 14 and the second region 15. In a feed-through capacitor 1, a signal terminal electrode 30 is connected with the power supply wiring 13 and a ground terminal electrode 40 is connected with the ground wiring 16 to be disposed in the first region 14. In a jumper chip component 6, a terminal electrode 8 is connected with the power supply wiring 13 to be disposed in the second region 15 for electrically connecting the divided power source wiring 13. A resistance value of the jumper chip component 6 is set so as to be equivalent to or lower than a DC resistance value of the feed-through capacitor 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
