SENSOR UNIT AND SOLID STATE IMAGE PICKUP DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sensor unit and a solid state image pickup device which reduce the influences of heat generated from a semiconductor chip on a solid state image sensor.

SOLUTION: A sensor unit 2A includes: a metal base member 20A; a solid state image sensor 30; and an amplifier chip 40. The base member 20A has a first placement surface 21a and a second placement surface 21b. The solid state image sensor 30 has a light reception surface 32 and is disposed on the first placement surface 21a so that a rear surface 33 and the first placement surface 21a face each other. The amplifier chip 40 is mounted on a substrate 50 disposed on the second placement surface 21b. The base member 20A further has a side wall part 25 facing a side surface of the solid state image sensor 30. The amplifier chip 40 and the solid state image sensor 30 are electrically connected with each other through a bonding wire 92. The amplifier chip 40 thermally couples to the base member 20A through a thermal via 53 of the substrate 50.

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