| 摘要 |
PURPOSE: A light emitting device and a manufacturing method thereof are provided to form a wavelength conversion layer having a uniform thickness on an LED chip and to provide the light emitting device having uniform color coordinates. CONSTITUTION: A wavelength conversion layer(200) is formed on a semiconductor structure(100) with a uniform thickness. The wavelength conversion layer changes the short wavelength light emitted from the semiconductor structure into long wavelength light. A transparent substrate(300) is adhered to the upper side of the wavelength conversion layer to maximize optical extraction. A diffusive bead diffuses the light into the transparent substrate. An n-electrode(180) and a p-electrode(190) are formed in the lower part of the semiconductor structure. |
