| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can hold enough amount of a connection material for connecting a semiconductor element with a wiring board. <P>SOLUTION: A semiconductor device 1 comprises element electrode terminals 4 of a semiconductor element 6, and wiring electrode terminals 3 provided on a wiring board 5. Because each wiring electrode terminal 3 includes more than one bump electrode 2 for connecting the element electrode terminal 4 and the wiring electrode terminal 3, a gelatinous adhesive can be held between two bump electrodes thereby to ensure a stable amount of the adhesive. <P>COPYRIGHT: (C)2013,JPO&INPIT |
