NITRIDE SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a high-quality nitride semiconductor substrate which inhibits scratch of a nitride semiconductor substrate caused by chipping occurring at an edge part of a nitride semiconductor crystal in a mechanical polishing process in a nitride semiconductor substrate manufacturing process.

SOLUTION: A nitride semiconductor substrate manufacturing method comprises performing polishing until a dark point can be identified on a periphery of a nitride semiconductor crystal by cathode luminescence observation at the periphery before a second mechanical polishing process of removing an affected layer, thereby to provide a high-quality nitride semiconductor substrate.

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