| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method capable of resolving inconvenience by aligning a pre-preg and a conductor pattern almost flush with each other. <P>SOLUTION: A support substrate 1 is opposed to a copper foil 2 with thickness of 12 μm or less, and they are adhered by a frame-shaped viscosity layer 4. Peripheral edges of the viscosity layer 4 and the copper foil 2 are made attachable and detachable to constitute an intermediate body. A predetermined electrode pattern 9 is formed on the copper foil 2 of the intermediate body by a semi-additive method, and a pre-preg 10 and a copper foil 11 for lamination are laminate-pressed to the predetermined electrode pattern 9 of the intermediate body to form a predetermined wiring pattern on the copper foil 11 for lamination and constitute a laminate body 12. After the support substrate 1 is removed from the laminate body 12 together with the viscosity layer 4, the copper foil 2 is removed from the pre-preg 10 of the laminate body 12 so as to align the predetermined electrode pattern 9 and the pre-preg 10 flush with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
