| 摘要 |
PURPOSE: A wafer bonding apparatus for bonding a lid glass to a wafer is provided to reduce a thickness difference by uniformly maintaining a gap between a first bonding jig and a second bonding jig. CONSTITUTION: A first bonding jig(200) mounts a wafer or a lid glass. A second bonding jig(300) faces the first bonding jig. A gap determination member controls a gap between the first bonding jig and the second bonding jig. A press module(400) pressurizes the second bonding jig toward the first bonding jig. A gap accommodating grooves are opened toward a second jig body. |
