| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a through hole substrate which allows for enhancement in circularity of the opening of a through hole. <P>SOLUTION: In the manufacturing method of a through hole substrate, a conductive substrate 2 having a recess 1 or a through hole is prepared. Subsequently, the recess 1 or through hole is filled with a metal 3, and the conductive substrate surface is polished at least from the bottom 6 side of the recess 1 or one side of the through hole. Thereafter, the filling metal 3 is removed thus manufacturing a through hole substrate having a through hole 4. Typically, the conductive substrate 2 is a silicon substrate. For example, a metal 3 having etching selectivity to the conductive substrate 2 fills the recess from the bottom or the through hole from one side by plating. <P>COPYRIGHT: (C)2013,JPO&INPIT |
