CLEANING LIQUID COMPOSITION FOR ELECTRONIC DEVICE

摘要

PURPOSE: A cleaning liquid composition is provided to have excellent metal impurity and micro-particle removal, to prevent corrosion of Cu, and to clean a semiconductor substrate with a copper wire. CONSTITUTION: A cleaning liquid composition includes one or two more phosphonic acid-based chelating agents and one or two more basic compound not including metal, and has a hydrogen ion concentration(pH) of 8-10. The semiconductor substrate is a substrate after chemical and mechanical polishing. The basic compound is a quaternary ammonium compound or linear aliphatic amine. The cleaning composition additionally includes one or two more anionic or non-ionic surfactants.