METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of a PCB(Printed Circuit Board) is provided to control the thermal expansion coefficient of a laminated plate which is used when the PCB is laminated, thereby solving the warpage problem when the PCB is laminated. CONSTITUTION: A manufacturing method of a PCB comprises the steps of; laminating the PCB using the thermal expansion coefficient of a laminated plate; and using the laminated plate of which the coefficient thermal expansion is 20ppm/°C or more when the PCB is laminated. [Reference numerals] (AA) Lamination contraction distance (um); (BB) First lamination contraction; (CC) Second lamination contraction; (DD) Total lamination contraction; (EE) Second; (FF) Laminated plate; (GG) First; (HH) Comparative example 1; (II) Comparative example 2; (JJ) Example 1; (KK) Thermal expansion coefficient of a laminated plate