发明名称 COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF
摘要 IT IS AN OBJECT OF THE INVENTION TO PROVIDE A COMPOSITE WITH SUFFICIENTLY RELIABLE BONDING AND ADEQUATELY MINIMIZED GENERATION OF FLUFF FROM FLAKING RESIN DUST AND FIBERS. THIS OBJECT IS ACHIEVED BY THE COMPOSITE (100) OF THE INVENTION THAT COMPRISES A FIBER SHEET (101) IMPREGNATED WITH A RESIN COMPOSITION (102), WHEREIN THE 20�C STORAGE ELASTIC MODULUS OF THE CURED RESIN COMPOSITION (102) IS 100-2000 MPa. THE COMPOSITE (I 00) OPTIONALLY CONTAINS PERFORATIONS (103).
申请公布号 MY148958(A) 申请公布日期 2013.06.14
申请号 MY2007PI01939 申请日期 2007.11.07
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 NOZOMU TAKANO;MASAKI KAMIYA
分类号 C08J5/24 主分类号 C08J5/24
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