发明名称 |
COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF |
摘要 |
IT IS AN OBJECT OF THE INVENTION TO PROVIDE A COMPOSITE WITH SUFFICIENTLY RELIABLE BONDING AND ADEQUATELY MINIMIZED GENERATION OF FLUFF FROM FLAKING RESIN DUST AND FIBERS. THIS OBJECT IS ACHIEVED BY THE COMPOSITE (100) OF THE INVENTION THAT COMPRISES A FIBER SHEET (101) IMPREGNATED WITH A RESIN COMPOSITION (102), WHEREIN THE 20�C STORAGE ELASTIC MODULUS OF THE CURED RESIN COMPOSITION (102) IS 100-2000 MPa. THE COMPOSITE (I 00) OPTIONALLY CONTAINS PERFORATIONS (103). |
申请公布号 |
MY148958(A) |
申请公布日期 |
2013.06.14 |
申请号 |
MY2007PI01939 |
申请日期 |
2007.11.07 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
NOZOMU TAKANO;MASAKI KAMIYA |
分类号 |
C08J5/24 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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