| 摘要 |
The present invention relates to an image sensor in which substrates are stacked. In the multi-substrate image sensor according to the present invention, a first photodiode is disposed on a first substrate, and a second photodiode is disposed on a second substrate. Then, the two substrates are aligned with and bonded to each other to electrically connect the two photodiodes to each other, thereby manufacturing an integrated photodiode within one pixel. |
