发明名称 |
METHOD OF PROTECTING AGAINST VIA FAILURE AND STRUCTURE THEREFOR |
摘要 |
A method is for forming a decoy via and a functional via. The method includes forming the functional via between a metal portion of a first interconnect layer and a portion of a second interconnect layer. The method further includes forming the decoy via in a protection region between the metal portion of the first interconnect layer and a metal portion of the third interconnect level. |
申请公布号 |
US2013147051(A1) |
申请公布日期 |
2013.06.13 |
申请号 |
US201113313179 |
申请日期 |
2011.12.07 |
申请人 |
SHROFF MEHUL D.;REBER DOUGLAS M.;TRAVIS EDWARD O. |
发明人 |
SHROFF MEHUL D.;REBER DOUGLAS M.;TRAVIS EDWARD O. |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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