STRENGTHENED GLASS SUBSTRATE CUTTING METHOD

摘要

Disclosed is a strengthened glass substrate cutting method wherein a strengthened glass substrate can be cut using only a laser scribing process, without any use whatsoever of a mechanical breaking process or cooling process. The strengthened glass substrate cutting method comprises the steps of: forming an initial crack in the place where the cutting of the strengthened glass substrate will start; pre-forming a heating line in the strengthened glass substrate by shining a laser beam, via an optical heating instrument, progressively towards the initial crack from a place on the strengthened glass substrate where the initial crack was not formed; and, once the laser beam has been shone as far as the initial crack, using the laser beam to cut the strengthened glass substrate along the previously formed heating line, using the initial crack as the starting point.