发明名称 |
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide: methods and devices for fabricating printable semiconductor elements and assembling the printable semiconductor elements on substrate surfaces; and stretchable semiconductor structures and stretchable electronic devices offering good performance in stretched configurations. <P>SOLUTION: A semiconductor material such as a semiconductor nanowire is disposed on a flexible substrate comprising a polymeric material by use of a printing process including transfer. Orientation processing with a magnetic or electric field is suitably applied to the semiconductor. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013118391(A) |
申请公布日期 |
2013.06.13 |
申请号 |
JP20130000174 |
申请日期 |
2013.01.04 |
申请人 |
BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS |
发明人 |
RALPH G NUZZO;JOHN A ROGERS;ETIENNE MENARD;LEE KEON-JAE;KHANG DAHL-YOUNG;SUN YUGANG;MATTHEW MEITL;ZHU ZHENGTAO |
分类号 |
H01L21/336;B81C1/00;H01L21/77;H01L29/06;H01L29/786;H01L31/0312;H01L31/04;H01L31/10;H01L31/18 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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