发明名称 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
摘要 <P>PROBLEM TO BE SOLVED: To provide: methods and devices for fabricating printable semiconductor elements and assembling the printable semiconductor elements on substrate surfaces; and stretchable semiconductor structures and stretchable electronic devices offering good performance in stretched configurations. <P>SOLUTION: A semiconductor material such as a semiconductor nanowire is disposed on a flexible substrate comprising a polymeric material by use of a printing process including transfer. Orientation processing with a magnetic or electric field is suitably applied to the semiconductor. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013118391(A) 申请公布日期 2013.06.13
申请号 JP20130000174 申请日期 2013.01.04
申请人 BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS 发明人 RALPH G NUZZO;JOHN A ROGERS;ETIENNE MENARD;LEE KEON-JAE;KHANG DAHL-YOUNG;SUN YUGANG;MATTHEW MEITL;ZHU ZHENGTAO
分类号 H01L21/336;B81C1/00;H01L21/77;H01L29/06;H01L29/786;H01L31/0312;H01L31/04;H01L31/10;H01L31/18 主分类号 H01L21/336
代理机构 代理人
主权项
地址