| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which only one surface side of the wiring board can be efficiently and securely plated. <P>SOLUTION: In a preparation process, a plurality of stack structures 30 are prepared which each have a plurality of main surface-side connection terminals 41 and a plurality of reverse surface-side connection terminals 45 formed and also have respective resin insulating layers 21-23 and a solder resist layer 20 formed. In a uniting process, the stack structures 30 are united such that sides of reverse surfaces 32 of the two stack structures 30 face each other so as to prevent a plating liquid from entering the sides of the back surfaces 32. In a plating process, electroless plating and electrolytic plating are carried out to form tin plating layers to serve as bumps on top surfaces of the main surface-side connection terminals 41. In a separating process, the respective stack structures 30 are separated to have the reverse surfaces 32 exposed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
