| 发明名称 |
PATTERN-FORMING COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME |
| 摘要 |
The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost. |
| 申请公布号 |
US2013146342(A1) |
申请公布日期 |
2013.06.13 |
| 申请号 |
US201213611220 |
申请日期 |
2012.09.12 |
| 申请人 |
EOM YONG SUNG;CHOI KWANG-SEONG;BAE HYUN-CHEOL;NOH JUNG HYUN;MOON JONG TAE;ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
EOM YONG SUNG;CHOI KWANG-SEONG;BAE HYUN-CHEOL;NOH JUNG HYUN;MOON JONG TAE |
| 分类号 |
H01B1/02;C25D5/02;H05K1/09;H05K3/00;H05K3/12 |
主分类号 |
H01B1/02 |
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