发明名称 PCB SOLDERING APPARATUS FOR INPUT/OUTPUT LEAD-WIRE
摘要 PURPOSE: A soldering apparatus for a lead wire PCB(Printed Circuit Board) used for applying power and a load is provided to remarkably reduce time required for a soldering process by performing soldering work for multiple soldering parts on a PCB while carrying a molten lead supply unit from one side to the other side. CONSTITUTION: A soldering apparatus for a lead wire PCB used for applying power and a load includes a first sliding unit(200), a second sliding unit, a molten lead supply unit, and an elevation unit. The first sliding unit supports a PCB and moves the PCB backward and forward. The second sliding unit moves in a direction crossing the moving direction of the first sliding unit. The molten lead supply unit is installed at the second sliding unit. The elevation unit is installed at the second sliding unit and moves the molten lead supply unit up and down.
申请公布号 KR101274487(B1) 申请公布日期 2013.06.13
申请号 KR20120077962 申请日期 2012.07.17
申请人 KOREA INSTITUTE OF LIGHITING TECHNOLOGY;INKO LABS;SUNIL ELECOMM CO., LTD. 发明人 LEE, YOUNG JOO;KIM, YOUNG WOOK;OH, WON HO;KANG, HAK CHEAL
分类号 B23K3/00;H05K3/34 主分类号 B23K3/00
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