| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain adhesion force between each semiconductor module 14 and each cooling module 16 by conducting an operation from a direction perpendicular to the lamination direction in a semiconductor cooler 2 including a semiconductor lamination unit 4 formed by alternately laminating the semiconductor modules 14 and the cooling modules 16. <P>SOLUTION: A housing inclination surface 38 is formed at a housing 6. A screw member is screwed into the housing 6 in an orthogonal direction and a wedge inclination surface 44 is pressed against the housing inclination surface 38. A wedge member 8 is pressed out toward a bearing surface 30 of the housing 6. The wedge member 8 presses a semiconductor lamination unit 4 against the bearing surface 30 of the housing 6 through a plate spring 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
