SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To make it easy to manufacture an LED device in which an LED die is covered with a phosphor cap.

SOLUTION: An LED device 10 comprises an LED die 20 flip-chip mounted on a circuit board 14 and covered with a phosphor cap 11. In this case, a planar outer shape of the phosphor cap 11 and a planar outer shape of the circuit board 14 are the same. The LED device 10 can be obtained by only performing the steps of: preparing an aggregate substrate 14a on which the LED die 20 is flip-chip mounted and a phosphor cap sheet 11a; overlapping the phosphor cap sheet 11a on the aggregate substrate 14a; and cutting the aggregate substrate 14a and the phosphor cap sheet 11a.

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