发明名称 LASER CUTTING DEVICE AND LASER CUTTING METHOD
摘要 An object is to obtain a laser cutting device and a laser cutting method with which a thick processing item can be cut by using laser light whose wavelength is shorter than that of CO2 laser light. With a laser cutting device (10), a laser emitting unit (24) emits a laser beam (YAG-based laser light whose wavelength is shorter than that of CO2 laser light) for cutting a processing item (30), an optical system (26) focuses the laser beam so that the laser beam has an elliptical cross-sectional shape and so that a long-axis direction of the ellipse is aligned with a direction in which cutting of the processing item (30) progresses, and thus, the elliptically-focused laser beam contributes to raising the temperature of a molten pool inside the processing item (30).
申请公布号 US2013146572(A1) 申请公布日期 2013.06.13
申请号 US201113816996 申请日期 2011.10.06
申请人 WATANABE MASAO 发明人 WATANABE MASAO
分类号 B23K26/073;B23K26/38 主分类号 B23K26/073
代理机构 代理人
主权项
地址