发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <p>PURPOSE: A substrate processing apparatus and a substrate processing method are provided to quickly cool a heated substrate and transfer the substrate, and to prevent overbake without a cooling apparatus. CONSTITUTION: Heat treatment parts(PEB1-PEB3) perform a thermal process on a substrate(W). Cooling treatment parts(CP1-CP6) perform a cooling process on the substrate. A substrate transfer part(20) moves the substrate between the heat treatment part and the cooling treatment part. An indexer(10) moves the substrate processed by a developing process to the outside. The indexer includes a mounting table(11) for a series of carriers(C) and an indexer robot(12) for placing the processed substrate to each carrier.</p>
申请公布号 KR20130062863(A) 申请公布日期 2013.06.13
申请号 KR20120086203 申请日期 2012.08.07
申请人 SOKUDO CO., LTD. 发明人 HASHIMOTO KATSUMI;NAKANISHI MANABU;MATSUSHITA TAKASHI
分类号 H01L21/027;H01L21/02 主分类号 H01L21/027
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